Detailed Product Description

2.       High heating effect: controllable heat energy; just more than 5 minutes is enough for you to dismantle IC.

3.       Super strong penetrability and even radiation: Heat radiation penetrates the elements evenly, the upside can receice same heat energy from the same heat source, which can guarantee the elements and PCB board experience same extends of expansion and contraction. This can avoid all kinds of risk, such as the explosion caused by local over-heart of the element, faults in the lines of PCB board, the distortion of the FPC board etc. Security is extremely important, especially traditional Airgun is flowing heat wind, low heat energy, the process of heating the elements is from outside to inside, from local to the whole; meanwhile, impacts of heat energy caused by hot wind from Airgun also result in low repair efficiency and the damage of parts and components. But infrared can avoid all these disadvantages easily. These excellent capabilities make our products unbeatable when it dismantles waterproof solid sealing colloid around the chip.

4.       Radiation: Far-infrared neednt Transmission media such as air. It acts on the elements directly, there is no interfere from airs stir. So it can avoid the replacement of the adjacent element and the heating of the circumjacent objects and the operator.

5.       Unsolder/repair BGAQFPSOPCSPPLCC DIP, BGA with waterproof solid sealing colloid.

6.       Turn the arm of the machine left/right and up/down to adjust the window of heat radiation according to the size of the elements. This can protect the circumjacent small elements from replacement and lose.

7.       800W hot-melt system: it is convenient to get rid of IC sol.

Other Modle:T862/T862++/T862A/T863/T870